EAN/UPC: Ostalo
Broj jezgara: 2
Proizvođač: Intel
Slot/Soket: Socket Socket G1 / rPGA988A

Polovan neispitan Intel P6100 procesor.Ide pod neispravno bez garancije i reklamacije.Ima sve nogice.Sa neta:Mobile Pentium P6100 is a dual-core budget microprocessor built on Westmere microarchitecture. The micro-architecture uses newer 32 nm manufacturing process, and integrates two dies in one package. The first die contains two CPU cores and shared 3 MB L3 cache, while the second die includes DDR3-compatible memory controller, and HD-capable graphics controller running at 500 MHz. The P6100 microprocessor runs at 2 GHz, and incorporates only basic Westemere technologies - EM64T, Execute disable bit and SSE instructions up to SSE4. Thermal Design Power of this model is 35 Watt, which is standard for mobile processors of its class. The Pentium Mobile P6100 will be manufactured in micro-PGA package only, and will fit socket 988 motherboards. The CPU should be available in 2010, and it is rumored to be launched in September 2010.

Dual-Core Pentium P6100 was spotted in Lenovo notebooks as early as May 2010. Since then this model appeared in specifications of a few other notebooks:

Acer eMachines D732 and E732.
Fujitsu LIFEBOOK NH570 and LIFEBOOK A530/AH530.
Lenovo IdeaPad Z360 and Z560 notebooks.


Intel Pentium P6100 specifications
General information

Type CPU / Microprocessor
Market segment Mobile
Family Intel Pentium Dual-Core Mobile
Model number ? P6100
CPU part number

CP80617004125AL is an OEM/tray microprocessor

Frequency ? 2000 MHz
Bus speed ? 2.5 GT/s DMI
Clock multiplier ? 15
Package 988-pin micro-FCPGA10 (rPGA988A)
Socket Socket G1 / rPGA988A
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date Sep 26, 2010
End-of-Life date Last order date is October 16, 2012
Last shipment date is April 16, 2013

S-spec numbers

Production processors
Part number SLBUR
CP80617004125AL +

Architecture / Microarchitecture

Microarchitecture Nehalem (Westmere)
Platform Calpella
Processor core ? Arrandale
Core stepping ? K0 (SLBUR)
Manufacturing process 0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die)
Die size 81mm2 (CPU die)
114mm2 (IMC / graphics die)
Data width 64 bit
The number of cores 2
The number of threads 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size ? 2 x 256 KB
Level 3 cache size Shared 3 MB
Cache latency 4 (L1 cache)
11 (L2 cache)
35 (L3 cache)
Physical memory 8 GB
Multiprocessing Not supported
Features

MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
EM64T / Extended Memory 64 technology / Intel 64 ?
NX / XD / Execute disable bit ?

Low power features Enhanced SpeedStep technology ?

Integrated peripherals / components

Integrated graphics

GPU Type: HD (Nehalem)
Base frequency (MHz): 500
Maximum frequency (MHz): 667
The number of supported displays: 2

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-800, DDR3-1066
Maximum memory bandwidth (GB/s): 17.1

Other peripherals

Direct Media Interface
PCI Express 2.0 interface


Electrical / Thermal parameters

Minimum/Maximum operating temperature ? 0°C - 90°C
Thermal Design Power ? 35 Watt