Proizvođač: AMD

AMD Phenom II Triple-Core Mobile N830 - HMN830DCR32GM , ispravan.
Type CPU / Microprocessor
Market segment Mobile
Family AMD Phenom II Triple-Core Mobile
Model number ? N830
CPU part number
HMN830DCR32GM is an OEM/tray microprocessor
Stepping codes AADHC AD NADHC AD
Frequency ? 2100 MHz
Bus speed ? One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock multiplier ? 10.5
Package 638-pin lidless organic micro Pin Grid Array (UOL638)
AMD Package number 30605
Socket Socket S1 (S1g4)
Size 1.38` x 1.38` / 3.5cm x 3.5cm
Weight 0.2oz / 5.7g (measured)
0.2oz / 6.5g (by specifications)
Introduction date May 12, 2010
End-of-Life date Last order date is 3rd quarter 2011
Last shipment date is 1st quarter 2012

Architecture / Microarchitecture
Microarchitecture K10
Platform Danube
Processor core ? Champlain
Core stepping ? BL-C3
CPUID 100F53
Manufacturing process 0.045 micron silicon-on-insulator (SOI) technology
Data width 64 bit
The number of cores 3
The number of threads 3
Floating Point Unit Integrated, 128-bit wide
Level 1 cache size ? 3 x 64 KB 2-way set associative instruction caches
3 x 64 KB 2-way set associative data caches
Level 2 cache size ? 3 x 512 KB 16-way set associative caches
Level 3 cache size None
Cache latency [1] 3 (L1 cache)
15 (L2 cache)
Multiprocessing Uniprocessor
Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
AMD64 / AMD 64-bit technology ?
EVP / Enhanced Virus Protection ?
AMD-V / AMD Virtualization technology
Low power features PowerNow!

Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3L-1066
Maximum memory bandwidth (GB/s): 21.3
Other peripherals HyperTransport technology 3.0

Electrical / Thermal parameters
Thermal Design Power ? 35 Watt